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产物取市场

SF206C

K7

●  低介电常数,低传输消耗。

●  优异的耐热性、耐化学性和电机能。

●  不露卤素,阻燃性到达 UL94 V-0 级 。

●  加工性好,适于快速压合和传统压合。

●  知足RoHS指令要求,不含铅、汞、镉、六价铬、多溴联苯、多溴联苯醚等。

应用领域

高频挠性印制板
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Items Method Condition Unit Typical Value
Peel Strength (90°)* IPC-TM-650 2.4.9D Accepted N/mm 0.92
288℃, 5s 0.92
Solder Resistance IPC-TM-650 2.4.13.F 288℃, 10s - No delamination
Dimensional Stability IPC-TM-650 2.2.4c After peeling off the paper % ±0.15/±0.15
Chemical Resistance IPC-TM-650 2.3.2G After Chemical Exposure % >85
Electric Strength IPC-TM-650 2.5.6.2A D-48/50+D-0.5/23 KV/mm 98
Volume Resistivity IPC-TM-650 2.5.17E C-96/35/90 MΩ/cm 4.19×109
Surface Resistance IPC-TM-650 2.5.17E C-96/35/90
2.34×106
Dielectric Constant (10GHz) IPC-TM-650 2.5.5.9 C-24/23/50 - 2.76
Dissipation Factor (10GHz) IPC-TM-650 2.5.5.9 C-24/23/50
- 0.0036
Resin Flow IPC-TM-650 2.3.17.1 180℃/10+60s,100kg/cm2
mm <0.15
Flammability UL94 E-24/125 Rating V-0

K7

*Testing after laminating with shining side of copper foil in suitablecondition

1.Certified to IPC-4203/2 Epoxy adhesive on one or twosides of poyimide dielectric

2.All the typical value listed above is for your reference only,please turn to Shengyi Technology Co., Ltd. for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.