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SF230

K7

●  较低的介电消耗,插益靠近LCP。

●  优异的耐热性、尺寸稳定性、耐化学性及电机能。

●  不露卤素,阻燃性到达UL94 VTM-0级。

●  知足RoHS指令要求,不含铅、汞、镉、六价铬、多溴联苯、多溴联苯醚等。

应用领域

高速电路用挠性印制板和刚挠性印制板
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Items Method Condition Unit Typical Value
Peel Strength (90°) IPC-TM-650 2.4.9D Accepted N/mm 1.36
288℃, 5s 1.47
Solder Resistance IPC-TM-650 2.4.13.F 288℃, 10s - No delamination
Dimensional Stability IPC-TM-650 2.2.4c E-0.5/150 % ±0.1/±0.1
Chemical Resistance IPC-TM-650 2.3.2G After Chemical Exposure % >95
Electric Strength IPC-TM-650 2.5.6.2A D-48/50+D-0.5/23 KV/mm 200
Volume Resistivity IPC-TM-650 2.5.17E C-96/35/90 MΩ/cm 1.2×109
Surface Resistance IPC-TM-650 2.5.17E C-96/35/90
4.5×106
Dielectric Constant (10GHz) IPC-TM-650 2.5.5.9 C-24/23/50 - 3.2
Dissipation Factor (10GHz) IPC-TM-650 2.5.5.9 C-24/23/50
- 0.0056
Folding Endurance JIS C-6471 R0.8×4.9N
Times >200
Flammability UL94 E-24/125 Rating VTM-0

K7

1.Certified to IPC-4204/25 Copper Clad Liquid Crystal Polymer Adhesiveless

2.All the typical value listed above is for your reference only,please turn to Shengyi Technology Co., Ltd. for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.