中文

产物取市场

LNB33

特性

● 电子级玻璃纤维布加强无机陶瓷填料和碳氢类树脂复合介质质料

具有优秀的低介电常数和介电消耗等高频机能
差别频次下稳固的介电机能
低的Z轴膨胀系数,优秀的尺寸稳定性


K7

高频无线通讯

卫星旌旗灯号传输装备

微带和蜂窝基站

天线和功率放大器

LNA/LNB

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Items Method Condition Unit Typical Value

Dielectric Constant, Dk

(Process)

2.5.5.5 10GHz/23℃ - 3.3±0.05
Dielectric Constant, Dk SPDR 10GHz/23℃ - 3.45±0.05
Dissipation Factor, Df 2.5.5.5 10GHz/23℃ - 0.0025
SPDR 10GHz/23℃ - 0.0032
TcDk SPDR
-40~150℃ ppm/℃ +125
Volume Resistivity 2.5.17.1 A ·cm 6.8 x 1014
Surface Resistivity
2.5.17.1
A 5.3 x 1013
Tensile Modulus (Y) ASTM D638 RT MPa
15577
Tensile Strength (Y) ASTM D638 RT MPa 112
Flexural Strength 2.4.4 - MPa 235
Tg 2.4.24 DSC >280
Td ASTM D3850 TGA >400
Thermal Conductivity ASTM D5470 100℃ W/m·K 0.69
Moisture Absorption 2.6.2.1 - % 0.1
Copper Peel Strength 2.4.8 After solder float 1oz. EDC foil N/mm 1.0

K7

  1. Clamped stripline method can potentially lower the actual dielectric constant due to presence of airgap. Dielectric constant in practice may be higher than the values listed.
  2. All the typical value is based on the 0.508mm (0.020'') specimen, and the specification sheet is based on IPC 4103/11.
  3. All the typical values listed above are for yourreference only and not intended for specification. Please contact ShengyiTechnology Co., Ltd. for detailed information. All rights from this data sheetare reserved by Shengyi Technology Co., Ltd.