中文

K7

Synamic 6N

K7

● 下Tg 205℃ (DMA)
● 低Dk/Df
● 更优秀的耐热性,Td>400℃,T300>60min
● 更低的Z轴热膨胀系数,优秀的通孔可靠性
● 更低的吸水率,优秀的耐干耐热性
● 无铅制程兼容

应用领域

● 超高速网络设备

● 服务器、交换机、存储、路由器、基站BBU等

● 下机能计算机

● 高频丈量仪器等

● 光通信产物

  • 产物机能
  • 产物证书
  • 材料下载
Items Method Condition Unit Typical Value
Tg 2.4.24.4 DMA 205
2.4.25D DSC
190
Td 2.4.24.6 5% wt. loss 405
T288
2.4.24.1 TMA min 120
T260 2.4.24.1
TMA min
60
Thermal Stress
2.4.13.1
288℃, solder dip
- >10s
Humidity Resistance
-
85℃/85%RH, 168hr
cycle
>10
- 288℃/10sec, Dipping
>10
CTE (Z-axis) 2.4.24 Before Tg ppm/℃ 56
After Tg ppm/℃ 232
50-260℃ % 2.1
Dissipation Constant
2.5.5.9 (1GHz)
C-24/23/50
- 3.31
2.5.5.5 (10GHz)
C-24/23/50
- 3.25
SPDR (10GHz)
C-24/23/50
- 3.42
Dissipation Factor
2.5.5.9 (1GHz)
C-24/23/50
- 0.0013
2.5.5.5 (10GHz)
C-24/23/50
- 0.0021
SPDR (10GHz)
C-24/23/50
- 0.0026
Peel Strength (1Oz) 2.4.8 288℃/10s N/mm 0.82
Water Absorption 2.6.2.1 E-1/105+D-24/23 % 0.09
Flammability
UL94
C-48/23/50
Rating
V-0

K7

1. All the typical value is based on the 0.76mm (6*2116) thickness specimen.

2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning

The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in and the third digit the relative humidity.