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S7040G

特性

● 下Tg 175℃ (DSC)
● 低Dk/Df (10GHz, IPC-TM-650 2.5.5.5) 3.72/0.0089
● 更低的Z轴热膨胀系数

K7

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● 线卡



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Items Method Condition Unit Typical Value
Tg 2.4.24.4 DMA 185
2.4.25D DSC
175
Td 2.4.24.6 5% wt. loss 405
T288
2.4.24.1 TMA min ≥60
T260 2.4.24.1
TMA min
≥60
Thermal Stress
2.4.13.1
288℃, solder dip
- ≥10
CTE (Z-axis) 2.4.24 Before Tg ppm/℃ 45
After Tg ppm/℃ 245
50-260℃ % 2.5
Dissipation Constant
2.5.5.9 (1GHz)
C-24/23/50
- 3.90
2.5.5.5(10GHz)
C-24/23/50
- 3.72
SPDR(10GHz)
C-24/23/50
- 4.06
Dissipation Factor
2.5.5.9 (1GHz)
C-24/23/50
- 0.007
2.5.5.5(10GHz)
C-24/23/50
- 0.0089
SPDR(10GHz)
C-24/23/50
- 0.01
Volume Resistivity 2.5.17.1 C-96/35/90 MΩ.cm 2.0×107
Surface Resistivity
2.5.17.1
C-96/35/90 4.0×107
Dielectric Breakdown 2.5.6 D-48/50+D-0.5/23 kV 45+kV NB
Peel Strength (1Oz) 2.4.8 288℃/10s N/mm 0.85
Water Absorption 2.6.2.1 E-1/105+D-24/23 % 0.12
Flammability
UL94
C-48/23/50
Rating
V-0 (HF)

K7

1. All the typical value is based on the 0.76mm (6*2116) specimen.

2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning

The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in and the third digit the relative humidity.