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S7439G

特性

● 下 Tg: 189℃(DMA), 181℃ (DSC)

● 低 Dk/Df (@10GHz, IPC-TM-650 2.5.5.5): 3.74/0.0060

● 较低的Z轴CTE

K7

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Items Method Condition Unit Typical Value
Tg IPC-TM-650 2.4.25 DSC 181
Tg IPC-TM-650 2.4.24.4
DMA
189
Td IPC-TM-650 2.4.24.6 5% wt. loss 383
CTE (Z-axis) IPC-TM-650 2.4.24 Before Tg ppm/℃ 50
After Tg ppm/℃ 240
50-260℃ % 2.5
T288 IPC-TM-650 2.4.24.1 TMA min ≥60
T260 IPC-TM-650 2.4.24.1 TMA min ≥60
Thermal Stress
IPC-TM-650 2.4.13.1
288℃, solder dip
-- PASS
Dissipation Constant (Dk) IPC-TM-650 2.5.5.9 1GHz -- 3.93
IPC-TM-6502.5.5.5
10GHz
-- 3.74
IEC 61189-2-721
10GHz -- 4.08
Dissipation Factor (Df) IPC-TM-650 2.5.5.9 1GHz -- 0.0043
IPC-TM-6502.5.5.5
10GHz
-- 0.0060
IEC 61189-2-721
10GHz -- 0.0070
Volume Resistivity
2.5.17.1
C-96/35/90
MΩ.cm
9.0×107
Surface Resistivity 2.5.17.1
C-96/35/90

2.0×107
Dielectric Breakdown
2.5.6
D-48/50+D-0.5/23
kV
45+kV NB
Peel Strength (1oz copper foil)
2.4.8 After thermal Stress 288℃,10s
N/mm 1.30
Water Absorption 2.6.2.1
E-1/105+D-24/23 % 0.12
Flammability UL94 C-48/23/50
Rating V-0

K7

1. All the typical value is based on the 0.76mm (6*2116) thickness specimen, but not guarantee data.

2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning

The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.