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S7439C

K7

● 下 Tg: 200℃(DMA), 190℃(DSC)

● Dk/Df (@10GHz, IPC-TM-6502.5.5.5) : 3.66/0.0060

● 下耐热性 Td> 380℃

● 较低的Z轴CTE

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服务器,转换器,基站,背板,单板,下机能计算器,路由器等
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Items Method Condition Unit Typical Value
Tg IPC-TM-650 2.4.25 DSC 190
Tg IPC-TM-650 2.4.24.4
DMA
200
Td IPC-TM-650 2.4.24.6 5% wt. loss 383
CTE (Z-axis) IPC-TM-650 2.4.24 Before Tg ppm/℃ 45
After Tg ppm/℃ 210
50-260℃ % 2.6
T300 IPC-TM-650 2.4.24.1 TMA min 60
T288 IPC-TM-650 2.4.24.1 TMA min 120
Thermal Stress
IPC-TM-650 2.4.13.1
288℃, solder dip
-- PASS
Dissipation Constant (Dk) IPC-TM-650 2.5.5.9 1GHz -- 3.85
IPC-TM-6502.5.5.5
10GHz
-- 3.66
IEC 61189-2-721
10GHz -- 4.05
Dissipation Factor (Df) IPC-TM-650 2.5.5.9 1GHz -- 0.0045
IPC-TM-6502.5.5.5
10GHz
-- 0.0060
IEC 61189-2-721
10GHz -- 0.0068
Volume Resistivity
2.5.17.1
After moisture resistance
MΩ.cm
4.03×107
E-24/125
3.05×107
Surface Resistivity 2.5.17.1
After moisture resistance

2.03×107
E-24/125
3.87×106
Arc Resistance
2.5.1
D-48/50+D-0.5/23
s
180
Dielectric Breakdown
2.5.6
D-48/50+D-0.5/23
kV
45+kV NB
Peel Strength (1oz RTF copper foil)
2.4.8 After thermal Stress 288℃,10s
N/mm 0.95
Water Absorption 2.6.2.1
E-1/105+D-24/23 % 0.09
Flammability UL94 C-48/23/50, E-24/125
Rating V-0

K7

1. All the typical value is based on 0.76mm (6*2116) thickness specimen, but not guarantee data.

2.All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.
Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning
The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.