产物取市场
S7038
特性
● 下Tg: 190℃ (DSC)● 更低的插益，Dk/Df (@10GHz, IPC-TM-650 2.5.5.5) : 3.62/0.0085
● 更低的Z轴热膨胀系数，优秀的通孔加工性
● 优秀的耐CAF机能
K7
● 服务器、交换机、路由器、基站子板- 产物机能
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| Items | Method | Condition | Unit | Typical Value | |
|---|---|---|---|---|---|
| Tg | IPC-TM-650 2.4.25 | DSC | ℃ | 190 | |
| Tg |
IPC-TM-650 2.4.24.4 |
DMA |
℃ |
200 | |
| Td | IPC-TM-650 2.4.24.6 | 5% wt. loss | ℃ | 345 | |
| CTE (Z-axis) | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 50 | |
| After Tg | ppm/℃ | 230 | |||
| 50-260℃ | % | 2.5 | |||
| T260 | IPC-TM-650 2.4.24.1 | TMA | min | >60 | |
| T288 | IPC-TM-650 2.4.24.1 | TMA | min | 30 | |
|
Thermal Stress |
IPC-TM-650 2.4.13.1 |
288℃, solder dip |
-- |
PASS |
|
| Dissipation Constant (Dk) | IPC-TM-650 2.5.5.9 | 1GHz | -- | 3.80 | |
|
IPC-TM-650 2.5.5.5 |
10GHz | -- | 3.62 | ||
| SPDR | 10GHz | -- | 3.92 | ||
| Dissipation Factor (Df) | IPC-TM-650 2.5.5.9 | 1GHz | -- | 0.0070 | |
|
IPC-TM-650 2.5.5.5 |
10GHz | -- | 0.0085 | ||
| SPDR | 10GHz | -- | 0.0087 | ||
|
Peel Strength (1oz RTF copper foil) |
IPC-TM-650 2.4.8 |
After thermal Stress 288℃,10s | N/mm | 1.0 | |
| Water Absorption | IPC-TM-650 2.6.2.1 | E-1/105+D-24/23 | % | 0.08 | |
| Flammability | UL94 | C-48/23/50 | Rating | V-0 | |
| E-24/125 | Rating | V-0 | |||
K7
1. All the typical value is based on 0.76mm (6*2116) thickness specimen, but not guarantee data.
2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.
Explanation:C=Humidity conditioning, D=Immersion conditioning in distilled water,E=Temperature conditioning
The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.