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S7038

特性

● 下Tg: 190℃ (DSC)
● 更低的插益,Dk/Df (@10GHz, IPC-TM-650 2.5.5.5) : 3.62/0.0085
● 更低的Z轴热膨胀系数,优秀的通孔加工性
● 优秀的耐CAF机能

K7

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Items Method Condition Unit Typical Value
Tg IPC-TM-650 2.4.25 DSC 190
Tg IPC-TM-650 2.4.24.4
DMA
200
Td IPC-TM-650 2.4.24.6 5% wt. loss 345
CTE (Z-axis) IPC-TM-650 2.4.24 Before Tg ppm/℃ 50
After Tg ppm/℃ 230
50-260℃ % 2.5
T260 IPC-TM-650 2.4.24.1 TMA min >60
T288 IPC-TM-650 2.4.24.1 TMA min 30
Thermal Stress
IPC-TM-650 2.4.13.1
288℃, solder dip
-- PASS
Dissipation Constant (Dk) IPC-TM-650 2.5.5.9 1GHz -- 3.80
IPC-TM-650 2.5.5.5
10GHz -- 3.62
SPDR 10GHz -- 3.92
Dissipation Factor (Df) IPC-TM-650 2.5.5.9 1GHz -- 0.0070
IPC-TM-650 2.5.5.5
10GHz -- 0.0085
SPDR 10GHz -- 0.0087
Peel Strength (1oz RTF copper foil)
IPC-TM-650 2.4.8
After thermal Stress 288℃,10s N/mm 1.0
Water Absorption IPC-TM-650 2.6.2.1 E-1/105+D-24/23 % 0.08
Flammability UL94 C-48/23/50 Rating V-0
E-24/125 Rating V-0

K7

1. All the typical value is based on 0.76mm (6*2116) thickness specimen, but not guarantee data.

2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

Explanation:C=Humidity conditioning, D=Immersion conditioning in distilled water,E=Temperature conditioning

The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in and the third digit the relative humidity.