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S7045G

K7

● 下Tg>170℃ (DSC),无卤质料
● 低插损,Dk/Df (@10GHz, IPC-TM-650 2.5.5.5): 3.98/0.0150
● 更低的Z轴热膨胀系数,优秀的通孔加工性

● 优秀的耐CAF机能

● 运用RTF铜箔能得到更低的旌旗灯号消耗

应用领域

● 服务器、交换机、路由器、基站、背板和线卡
  • 产物机能
  • 产物证书
  • 材料下载
Items Method Condition Unit Typical Value
Tg IPC-TM-650 2.4.25 DSC 175
Tg IPC-TM-650 2.4.24.4
DMA
180
Td IPC-TM-650 2.4.24.6 5% wt. loss 380
CTE (Z-axis) IPC-TM-650 2.4.24 Before Tg ppm/℃ 50
After Tg ppm/℃ 230
50-260℃ % 2.5
T260 IPC-TM-650 2.4.24.1 TMA min >60
T288 IPC-TM-650 2.4.24.1 TMA min >60
Thermal Stress
IPC-TM-650 2.4.13.1
288℃, solder dip
-- PASS
Dissipation Constant (Dk) IPC-TM-650 2.5.5.9 1GHz -- 4.40
IPC-TM-650 2.5.5.5
10GHz
-- 3.98
IEC 61189-2-721
10GHz -- 4.42
Dissipation Factor (Df) IPC-TM-650 2.5.5.9 1GHz -- 0.0100
IPC-TM-650 2.5.5.5
10GHz
-- 0.0145
IEC 61189-2-721
10GHz -- 0.0150
Peel Strength (1oz RTF copper foil) IPC-TM-650 2.4.8 A N/mm
After thermal Stress 288℃,10s N/mm 1.0
125℃ N/mm
Water Absorption
E-1/105+D-24/23 % 0.15
Flammability UL94 C-48/23/50 Rating V-0
E-24/125 Rating V-0

K7

1. All the typical value is based on 0.76mm (6*2116) thickness specimen, but not guarantee data.

2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning

The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in and the third digit the relative humidity.