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SP120N

特性

● 树脂活动度低、柔韧,不失落粉尘
剥离强度下,阻燃性到达UL94 V-0级
优异的耐热性和电机能
优异的加工性,可冲孔加工

K7

适用于阶梯板、多层刚挠联合印制电路板
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Items Method Condition Unit Typical Value
Tg 2.4.25D DSC

125
Td 2.4.24.6 5% wt. loss 315
T288
2.4.24.1 TMA min 3
T260 2.4.24.1
TMA min
30
Thermal Stress
2.4.13.1
288℃, solder dip
- after 6 cycles, no delamination
Volume Resistivity 2.5.17.1 C-96/35/90 MΩ.cm 5.0 x 108
Surface Resistivity
2.5.17.1
C-96/35/90 5.0 x 107
Peel Strength (1Oz) 2.4.8 288℃/10s N/mm 2.0
Water Absorption 2.6.2.1 E-1/105+D-24/23 % 0.15

K7

All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning

The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in and the third digit the relative humidity.