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K7

特性

● Tg>250℃ (TMA), Td>405℃ (5% loss, TGA), T300>60min
极低Z-热膨胀系数[1.20% (50-260℃)],优秀的通孔可靠性
下的高温模量连结率和高温可靠性
韧性树脂系统,不露MDA
无铅无卤兼容,相符RoHS/WEEE要求
相符IPC 4101D/40/41要求

K7

老化挑选板

井下钻探

航空航天

其他有临时高温情况需求的PCB

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Items Method Condition Unit Typical Value
Tg 2.4.24.4 DMA >250
Td 2.4.24.6 5% wt. loss 429
T300 2.4.24.1
TMA min
>60
CTE (Z-axis) 2.4.24 50-260℃ (X/Y) ppm/℃ 12~15
α1 (before Tg) ppm/℃ 45
50-260℃ % 1.20
Dissipation Constant (1GHz) 2.5.5.9 C-24/23/50 - 4.12
Dissipation Factor (1GHz)
2.5.5.9
C-24/23/50
- 0.007
Volume Resistivity 2.5.17.1 C-96/35/90 MΩ.cm 7.45 x 107
Surface Resistivity
2.5.17.1
C-96/35/90 4.79 x 107
Arc Resistance 2.5.1 D-48/50+D-0.5/23 s 180
Dielectric Breakdown 2.5.6 D-48/50+D-0.5/23 kV 40.5
Peel Strength (1Oz) 2.4.8 288℃/10s N/mm 1.37
Flexural Strength 2.4.4 A MPa 530
Water Absorption 2.6.2.1 E-1/105+D-24/23 % 0.26
Flammability
UL94
C-48/23/50
Rating
HB

K7

1. Specimen thickness: 1.6mm. Test method is according to IPC-TM-650.

2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning.

The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in and the third digit the relative humidity.