中文

产物取市场

SP175M

特性

● 无铅兼容
优秀的耐热可靠性
低的Z轴热膨胀系数
低吸水率

K7

适用于高厚径比和下多层PCB

普遍应用于计算机、通讯设备、精密仪器、仪器仪表、路由器等

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Items Method Condition Unit Typical Value
Tg 2.4.24.4 DMA 175
Td 2.4.24.6 5% wt. loss 348
T288
2.4.24.1 TMA min 20
T260 2.4.24.1
TMA min
60
Thermal Stress
2.4.13.1
288℃, solder dip
- >60s No Delamination
CTE (Z-axis) 2.4.24 Before Tg ppm/℃ 56
After Tg ppm/℃ 326
50-260℃ % 3.8
Dissipation Constant (1GHz) 2.5.5.9 C-24/23/50 - 3.6
Dissipation Factor (1GHz)
2.5.5.9
C-24/23/50
- 0.0164
Volume Resistivity 2.5.17.1 C-96/35/90 MΩ.cm 4.6 x 106
Surface Resistivity
2.5.17.1
C-96/35/90 7.9 x 105
Arc Resistance 2.5.1 D-48/50+D-0.5/23 s 90
Dielectric Breakdown 2.5.6 D-48/50+D-0.5/23 kV 45+kV NB
Peel Strength (1oz) 2.4.8 288℃/10s N/mm 1.3
Water Absorption 2.6.2.1 E-1/105+D-24/23 % 0.20
Flammability
UL94
C-48/23/50
Rating
V-0
CTI IEC60112 A Rating PLC3

K7

1. Specimen thickness: 1.8mm. Test method is according to IPC-TM-650.

2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning

The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in and the third digit the relative humidity.