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SI643HU

K7

Tg 245℃(DMA)
低的XY轴/Z轴CTE及更高模量
优秀的钻孔加工性
无卤素环保质料,合适无铅制程,相符RoHS/WEEE

应用领域

TF, UDP, SIM卡等

LED RGB显现
内嵌式存储
RF/摄像头/指纹识别模组
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Items Condition Unit SI643HU SI643U
Tg DMA 245 230
Td 5% wt. loss
409 400
CTE (Z-axis) x/y-axis(α1) ppm/℃ ~10 12-13
(40-260℃), z-axis(α1/α2)1)
ppm/℃
25/143 27/150
Dielectric Constant (1GHz)
- - 4.5 4.4
Dissipation Factor (1GHz)
- - 0.007 0.007
Solder Dipping
288 ℃
min
>30 >30
Peel Strength 1)
1/3 Oz, VLP Copper Foil N/mm 0.73 0.8
Young’s modulus
50℃
GPa 25 22
200℃ GPa 22 15
Flexural modulus1)
50℃ GPa 28 26
200℃ GPa 18 16
Water Absorption1)
A % 0.17 0.2
85℃/85%Rh, 168Hr % 0.54 0.63
Flammability
UL-94
Rating
V-0
V-0
Thermal Conductivity
- W/(m·K) 0.61 0.58

K7

All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning

The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in and the third digit the relative humidity.